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| Z0103NA Logic level four-quadrant triac Rev. 03 -- 5 August 2009 Product data sheet 1. Product profile 1.1 General description Passivated sensitive gate 4-Q triac in a SOT54 plastic package 1.2 Features and benefits Direct interfacing to logic level ICs Direct interfacing to low power gate drive circuits High blocking voltage of 800V Sensitive gate in four quadrants 1.3 Applications General purpose low power motor control Home appliances Industrial process control Low power AC Fan controllers 1.4 Quick reference data Table 1. VDRM IT(RMS) ITSM Quick reference Conditions Min full sine wave; Tlead 38 C; see Figure 1 and 4 full sine wave; tp = 20 ms; Tj(init) = 25 C; see Figure 2 and 3 full sine wave; tp = 16.7 ms; Tj(init) = 25 C Static characteristics IGT gate trigger current VD = 12 V; Tj = 25 C; T2+ G-; see Figure 6 VD = 12 V; Tj = 25 C; T2- GVD = 12 V; Tj = 25 C; T2+ G+ VD = 12 V; Tj = 25 C; T2- G+ 3 3 3 5 mA mA mA mA Typ Max 800 1 8 Unit V A A repetitive peak off-state voltage RMS on-state current non-repetitive peak on-state current Symbol Parameter - - 8.5 A NXP Semiconductors Z0103NA Logic level four-quadrant triac 2. Pinning information Table 2. Pin 1 2 3 Pinning information Symbol T2 G T1 Description main terminal 2 gate main terminal 1 T2 sym051 Simplified outline Graphic symbol T1 G 321 SOT54 (TO-92) 3. Ordering information Table 3. Ordering information Package Name Z0103NA TO-92 Description plastic single-ended leaded (through hole) package; 3 leads Version SOT54 Type number Z0103NA_3 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 -- 5 August 2009 2 of 12 NXP Semiconductors Z0103NA Logic level four-quadrant triac 4. Limiting values Table 4. Symbol VDRM IT(RMS) dIT/dt Limiting values Parameter repetitive peak off-state voltage RMS on-state current rate of rise of on-state current full sine wave; Tlead 38 C; see Figure 1 and 4 IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/s; T2+ G+ IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/s; T2+ GIT = 1 A; IG = 20 mA; dIG/dt = 100 mA/s; T2- GIT = 1 A; IG = 20 mA; dIG/dt = 100 mA/s; T2- G+ IGM PGM Tstg Tj ITSM peak gate current peak gate power storage temperature junction temperature non-repetitive peak on-state current I2t for fusing average gate power full sine wave; tp = 20 ms; Tj(init) = 25 C; see Figure 2 and 3 full sine wave; tp = 16.7 ms; Tj(init) = 25 C I2t PG(AV) tp = 10 ms; sine-wave pulse Conditions Min -40 Max 800 1 50 50 50 20 1 2 150 125 8 8.5 0.32 0.1 Unit V A A/s A/s A/s A/s A W C C A A A2s W In accordance with the Absolute Maximum Rating System (IEC 60134). 2.0 Ptot (W) 1.6 003aac259 conduction angle (degrees) 30 60 90 120 180 form factor a 4 2.8 2.2 1.9 1.57 = 180 120 90 60 1.2 0.8 30 0.4 0.0 0 0.2 0.4 0.6 0.8 1 IT(RMS) (A) 1.2 Fig 1. Total power dissipation as a function of RMS on-state current; maximum values Z0103NA_3 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 -- 5 August 2009 3 of 12 NXP Semiconductors Z0103NA Logic level four-quadrant triac 10 ITSM (A) 8 003aad318 6 4 IT ITSM t 1/f Tj(init) = 25 C max 2 0 1 10 102 number of cycles 103 Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values 003aad319 103 ITSM (A) IT ITSM t tp Tj(init) = 25 C max 102 (1) (2) 10 1 10-5 10-4 10-3 10-2 tp (s) 10-1 Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values Z0103NA_3 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 -- 5 August 2009 4 of 12 NXP Semiconductors Z0103NA Logic level four-quadrant triac 1.2 IT(RMS) (A) 003aac264 0.8 0.4 0 -50 0 50 100 150 Tlead (C) Fig 4. RMS on-state current as a function of lead temperature; maximum values 5. Thermal characteristics Table 5. Symbol Rth(j-a) Rth(j-lead) Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from Full cycle; see Figure 5 junction to lead Conditions Min Typ 150 Max 60 Unit K/W K/W 102 Zth(j-lead) (K/W) 10 003aac206 1 P 10-1 tp t 10-2 10-5 10-4 10-3 10-2 10-1 1 tp (s) 10 Fig 5. Transient thermal impedance from junction to lead as a function of pulse width Z0103NA_3 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 -- 5 August 2009 5 of 12 NXP Semiconductors Z0103NA Logic level four-quadrant triac 6. Characteristics Table 6. Symbol IGT Characteristics Parameter gate trigger current Conditions VD = 12 V; Tj = 25 C; T2+ G-; see Figure 6 VD = 12 V; Tj = 25 C; T2- GVD = 12 V; Tj = 25 C; T2+ G+ VD = 12 V; Tj = 25 C; T2- G+ IL latching current VD = 12 V; Tj = 25 C; IG = 0.1 A; T2+ G-; see Figure 7 VD = 12 V; Tj = 25 C; IG = 0.1 A; T2+ G+ VD = 12 V; Tj = 25 C; IG = 0.1 A; T2- G+ VD = 12 V; Tj = 25 C; IG = 0.1 A; T2- GIH VT VGT holding current on-state voltage gate trigger voltage VD = 12 V; Tj = 25 C; see Figure 10 IT = 1 A; see Figure 8 IT = 0.1 A; VD = 12 V; Tj = 25 C; see Figure 9 IT = 0.1 A; VD = 800 V; Tj = 125 C ID dVD/dt dVcom/dt off-state current rate of rise of off-state voltage rate of rise of commutating voltage VD = 800 V; Tj = 125 C VDM = 536 V; Tj = 110 C; gate open circuit; see Figure 11 VD = 400 V; Tj = 110 C; dIcom/dt = 0.44 A/ms; gate open circuit Dynamics charateristics 10 0.5 V/s V/s Min 0.2 Typ 1.3 Max 3 3 3 5 7 7 7 7 7 1.6 1.3 0.5 Unit mA mA mA mA mA mA mA mA mA V V V mA Static characteristics 4 IGT IGT(25C) 3 (1) (2) (3) (4) 003aaa205 3 IL IL(25C) 003aaa203 2 2 1 1 0 -50 0 50 100 Tj (C) 150 0 -50 0 50 100 Tj (C) 150 Fig 7. Fig 6. Normalized gate trigger current as a function of junction temperature Normalized latching current as a function of junction temperature Z0103NA_3 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 -- 5 August 2009 6 of 12 NXP Semiconductors Z0103NA Logic level four-quadrant triac 2 IT (A) 1.6 003aac258 1.6 VGT VGT(25C) 1.2 003aaa209 1.2 0.8 0.8 (1) (2) (3) 0.4 0.4 0 0 0.4 0.8 1.2 1.6 VT (V) 2 0 -50 0 50 100 Tj (C) 150 Fig 9. Normalized gate trigger voltage as a function of junction temperature Fig 8. On-state current as a function of on-state voltage 3 IH IH(25C) 003aaa204 2 1 0 -50 0 50 100 Tj (C) 150 Fig 10. Normalized holding current as a function of junction temperature Z0103NA_3 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 -- 5 August 2009 7 of 12 NXP Semiconductors Z0103NA Logic level four-quadrant triac 1.6 A 1.2 003aaa208 0.8 0.4 0 0 50 100 Tj (C) 150 Fig 11. Normalized critical rate of rise of off-state voltage as a function of junction temperature;typical values Z0103NA_3 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 -- 5 August 2009 8 of 12 NXP Semiconductors Z0103NA Logic level four-quadrant triac 7. Package outline Plastic single-ended leaded (through hole) package; 3 leads SOT54 c E d A L b 1 D 2 e1 e 3 b1 L1 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 5.2 5.0 b 0.48 0.40 b1 0.66 0.55 c 0.45 0.38 D 4.8 4.4 d 1.7 1.4 E 4.2 3.6 e 2.54 e1 1.27 L 14.5 12.7 L1(1) max. 2.5 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 REFERENCES IEC JEDEC TO-92 JEITA SC-43A EUROPEAN PROJECTION ISSUE DATE 04-06-28 04-11-16 Fig 12. Package outline SOT54 (TO-92) Z0103NA_3 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 -- 5 August 2009 9 of 12 NXP Semiconductors Z0103NA Logic level four-quadrant triac 8. Revision history Table 7. Revision history Release date 20090805 Data sheet status Product data sheet Change notice Supersedes Z0103_07_09_SERIES-02 Document ID Z0103NA_3 Modifications: * * * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Type number Z0103NA separated from data sheet Z0103_07_09_SERIES-02. Product data Product data Z0103_07_09_SERIES-01 - Z0103_07_09_SERIES-02 (9397 750 10102) Z0103_07_09_SERIES-01 (9397 750 09419) 20020912 20020411 Z0103NA_3 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 -- 5 August 2009 10 of 12 NXP Semiconductors Z0103NA Logic level four-quadrant triac 9. Legal information 9.1 Data sheet status Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Document status [1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 9.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Z0103NA_3 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 -- 5 August 2009 11 of 12 NXP Semiconductors Z0103NA Logic level four-quadrant triac 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 August 2009 Document identifier: Z0103NA_3 |
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